Boyd Corporation has acquired Sensata’s Thermal Testing and Controls business.
The company specializes in the design and manufacture of advanced thermal control systems, adapters and sockets critical to the thermal testing process for high-end logic and memory semiconductors. With a long history of serving the world’s leading semiconductor companies, the addition complements Boyd’s existing thermal business, which includes air-cooled and liquid-cooled thermal management technologies.
Boyd designs and manufactures complex thermal solutions for high performance semiconductors used in applications such as 5G, hyperscale data centers, eMobility and artificial intelligence. With this acquisition, Boyd expands its offering to current semiconductor customers by adding advanced controls and thermal test systems essential to the production of high-end memory and logic devices.
“This acquisition is a natural fit for Boyd and adds to our portfolio of thermal solutions for leading semiconductor companies,” said Doug Britt, CEO of Boyd. “The advanced technologists, materials scientists and solutions of Sensata’s Thermal Testing and Controls business expand Boyd’s presence in the rapidly growing semiconductor industry.”
Boyd is the parent company of Magnolia’s Inspec foams.
The acquired business will operate under the Boyd brand.
